Advanced Wirebond Interconnection Technology
Product details
| Management number | 233473521 | Release Date | 2026/06/27 | List Price | $54.17 | Model Number | 233473521 | ||
|---|---|---|---|---|---|---|---|---|---|
| Category | |||||||||
Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way. Read more
| ISBN10 | 1402077629 |
|---|---|
| ISBN13 | 978-1402077623 |
| Edition | 2004th |
| Language | English |
| Publisher | Springer |
| Dimensions | 6.66 x 1.51 x 9.04 inches |
| Item Weight | 2.45 pounds |
| Print length | 698 pages |
| Publication date | April 30, 2004 |
Bestseller ranking
Semiconductors
Customers who viewed this product also viewed
Waterproof Jackets
Correction of product information
If you notice any omissions or errors in the product information on this page, please use the correction request form below.
Correction Request Form